Zener Diode Structure and Process

ABSTRACT

A vertically stacked, planar junction Zener diode is concurrently formed with epitaxially grown FET raised S/D terminals. The structure and process of the Zener diode are compatible with Gate-Last high-k FET structures and processes. Lateral separation of diode and transistor structures is provided by modified STI masking. No additional photolithography steps are required. In some embodiments, the non-junction face of the uppermost diode terminal is silicided with nickel to additionally perform as a copper diffusion barrier.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a divisional application of U.S. application Ser. No.13/250,563, filed 30 Sep. 2011, titled “Zener Diode Structure AndProcess.”

FIELD OF THE INVENTION

The present invention relates generally to diodes, and more particularlyrelates to Zener diodes structures integrated with field effecttransistors, and processes for making same.

BACKGROUND

Advances in semiconductor manufacturing technologies have resulted indramatically increased circuit packing densities and higher speeds ofoperation. In order to achieve such increased densities a wide varietyof evolutionary changes have taken place with respect to semiconductorprocessing techniques and semiconductor device structures over theyears.

Some of the more recent changes in semiconductor processing and devicestructures include gate replacement, where polysilicon gate electrodestructures are removed after source/drain formation, and a high-k gatedielectric layer with a metal gate electrode are provided in theirplace; and source/drain terminal formation by epitaxial growth of p+ andn+ layers. In connection with source/drain terminal formation byepitaxial growth, some modern processes provide recesses adjacent a gateelectrode structure, prior to gate replacement, in which a firstconductivity type epitaxial layer is formed. Similarly, such processesmay provide raised source/drain terminals adjacent a different gateelectrode structure prior to gate replacement. These raised source/drainterminals may be formed by epitaxial growth without first forming arecess.

In addition to the formation of transistors, semiconductor processes arealso used to create other active and passive electrical components. Anexample of another active electrical component is the diode. Diodestructures result when semiconductor material of a first conductivitytype and a second conductivity type are formed adjacent to each other.Given the appropriate relative doping profiles, such diodes may have theelectrical performance characteristics that put them in a class ofdiodes referred to as Zener diodes.

A Zener diode is a special kind of diode that allows current to flow inthe forward direction just as an ideal diode does, and also allowscurrent to flow in the reverse direction when the voltage is above thebreakdown voltage without suffering the thermal damage that can beexperienced by non-Zener diodes operating in breakdown mode. Zenerdiodes are widely used as voltage references and as shunt regulators toregulate the voltage across small circuits. The operation and electricalcharacteristics of a Zener diode depends on the heavy doping of its p-njunction to allow electrons to tunnel from the valence band of thep-type material to the conduction band of the n-type material. Someconventionally formed Zener diodes, made in processes that integrate theformation of field effect transistors and Zener diodes, require the usethe interface of a lateral n+ and p+ structure to form the Zener diodejunction. Such conventional a Zener diode structure requires a largeamount of die area and tends to exhibit undesirably high leakagecurrent.

What is needed are diode structures that are compatible with theformation of epitaxially formed, raised source/drain terminals ingate-last, high-k MOSFET integrated circuits.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the invention are described with reference to theaccompanying drawings. In the drawings, like reference numbers indicateidentical or functionally similar elements. Additionally, the left mostdigit(s) of a reference number identifies the drawing in which thereference number first appears.

FIG. 1 is a cross-sectional view of a portion of a wafer having apartially fabricated integrated circuit thereon.

FIG. 2 shows the structure of FIG. 1 after a first hardmask layer hasbeen deposited, and then patterned to expose areas in which recesses areto be formed for subsequent p+ epi growth.

FIG. 3 shows the structure of FIG. 2 after recesses are formed for PFETsource/drains (S/D) and a Zener diode anode.

FIG. 4 shows the structure of FIG. 3 after P+ epi growth forms the PFETsource/drain (S/D) terminals and the Zener diode anode; and after thefirst hardmask has been removed.

FIG. 5 shows the structure of FIG. 4 after a second hardmask layer hasbeen deposited and patterned to expose areas in which n+ epi growth isto take place to form NFET S/D terminals and a Zener diode cathode.

FIG. 6 shows the structure of FIG. 5 after n+ epi growth forms NFET S/Dterminals and a Zener diode cathode.

FIG. 7 shows the structure of FIG. 6 after the second hardmask has beenremoved, and contact structures have been formed to make electricalcontact with both the anode (i.e., p+) and the cathode (i.e., n+) of theZener diode.

FIG. 8 is a flow diagram of an illustrative process in accordance withthe present invention.

DETAILED DESCRIPTION

The following Detailed Description refers to accompanying drawings toillustrate exemplary embodiments consistent with the invention.References in the Detailed Description to “one exemplary embodiment,”“an illustrative embodiment”, “an exemplary embodiment,” and so on,indicate that the exemplary embodiment described may include aparticular feature, structure, or characteristic, but every exemplaryembodiment may not necessarily include the particular feature,structure, or characteristic. Moreover, such phrases are not necessarilyreferring to the same exemplary embodiment. Further, when a particularfeature, structure, or characteristic is described in connection with anexemplary embodiment, it is within the knowledge of those skilled in therelevant art(s) to affect such feature, structure, or characteristic inconnection with other exemplary embodiments whether or not explicitlydescribed.

The exemplary embodiments described herein are provided for illustrativepurposes, and are not limiting. Other exemplary embodiments arepossible, and modifications may be made to the exemplary embodimentswithin the spirit and scope of the invention. Therefore, the DetailedDescription is not meant to limit the invention. Rather, the scope ofthe invention is defined only in accordance with the following claimsand their equivalents.

The following Detailed Description of the exemplary embodiments will sofully reveal the general nature of the invention that others can, byapplying knowledge of those skilled in relevant art(s), readily modifyand/or adapt for various applications such exemplary embodiments,without undue experimentation, without departing from the spirit andscope of the invention. Therefore, such adaptations and modificationsare intended to be within the meaning and plurality of equivalents ofthe exemplary embodiments based upon the teaching and guidance presentedherein. It is to be understood that the phraseology or terminologyherein is for the purpose of description and not of limitation, suchthat the terminology or phraseology of the present specification is tobe interpreted by those skilled in relevant art(s) in light of theteachings herein.

Terminology

The terms, chip, die, integrated circuit, semiconductor device, andmicroelectronic device, are often used interchangeably in the field ofelectronics. The present invention is applicable to all the above asthese terms are generally understood in the field.

With respect to chips, it is common that power, ground, and varioussignals may be coupled between them and other circuit elements viaphysical, electrically conductive connections. Such a point ofconnection may be referred to as an input, output, input/output (I/O),terminal, line, pin, pad, port, interface, or similar variants andcombinations. Although connections between and amongst chips arecommonly made by way of electrical conductors, those skilled in the artwill appreciate that chips and other circuit element's may alternativelybe coupled by way of optical, mechanical, magnetic, electrostatic, andelectromagnetic interfaces.

The terms metal line, trace, wire, conductor, signal path and signalingmedium are all related. The related terms listed above, are generallyinterchangeable, and appear in order from specific to general. In thisfield, metal lines are sometimes referred to as traces, wires, lines,interconnect or simply metal. Metal lines, such as aluminum (Al), copper(Cu), an alloy of Al and Cu, an alloy of Al, Cu and silicon (Si),tungsten (W), and nickel (Ni) are conductors that provide signal pathsfor coupling or interconnecting, electrical circuitry. Other conductors,both metal and non-metal are available in microelectronic devices.Materials such as doped polysilicon, doped single-crystal silicon (oftenreferred to simply as diffusion, regardless of whether such doping isachieved by thermal diffusion or ion implantation), titanium (Ti),molybdenum (Mo), and refractory metal suicides are examples of otherconductors.

Polycrystalline silicon is a nonporous form of silicon made up ofrandomly oriented crystallites or domains. Polycrystalline silicon isoften formed by chemical vapor deposition from a silicon source gas orother methods and has a structure that contains large-angle grainboundaries, twin boundaries, or both. Polycrystalline silicon is oftenreferred to in this field as polysilicon, or sometimes more simply aspoly.

Epitaxial layer refers to a layer of single crystal semiconductormaterial. In this field, the epitaxial layer is commonly referred to“epi.”

FET, as used herein, refers to metal-oxide-semiconductor field effecttransistors (MOSFETs). An n-channel FET is referred to herein as anNFET. A p-channel FET is referred to herein as a PFET.

As used herein, “gate” refers to the insulated gate terminal of a FET.

Source/drain (S/D) terminals refer to the terminals of a FET, betweenwhich conduction occurs under the influence of an electric field,subsequent to the inversion of the semiconductor surface under theinfluence of an electric field resulting from a voltage applied to thegate terminal of the FET. Generally, the source and drain terminals of aFET are fabricated such that they are geometrically symmetrical. Withgeometrically symmetrical source and drain terminals it is common tosimply refer to these terminals as source/drain terminals, and thisnomenclature is used herein. Designers often designate a particularsource/drain terminal to be a “source” or a “drain” on the basis of thevoltage to be applied to that terminal when the FET is operated in acircuit.

The terms contact and via, both refer to structures for electricalconnection of conductors from different interconnect levels. These termsare sometimes used in the art to describe both an opening in aninsulator in which the structure will be completed, and the completedstructure itself. For purposes of this disclosure, contact and via bothrefer to the completed structure.

Substrate, as used herein, refers to the physical object that is thebasic workpiece that is transformed by various process operations intothe desired microelectronic configuration. A substrate may also bereferred to as a wafer. Wafers, may be made of semiconducting,non-semiconducting, or combinations of semiconducting andnon-semiconducting materials.

The term vertical, as used herein, means substantially perpendicular tothe surface of a substrate.

Overview

It is well-known that various changes in semiconductor device structureshave been, and continue to be, made in order to accommodate themanufacturing process requirements to produce ever smaller electricalcomponents on integrated circuits. Some processes, such as recent CMOSprocesses that include gate replacement (i.e., gate-last, high-k) alsoinclude the formation of FET S/D terminals by epitaxial growth, whereinS/D terminals of a first conductivity type are formed in recesses, andS/D terminals of a second conductivity type are formed without recesses(i.e., raised S/D terminals).

In accordance with the present invention, the process steps provided bythese aforementioned CMOS processes are adapted to produce a verticallystacked, planar junction Zener diode structure with anode and cathodecontacts on the same side of the wafer.

Process

FIGS. 1-8 illustrate a process for forming a Zener diode in accordancewith the present invention. The figures illustrate various components,their arrangements, and interconnections. Unless expressly stated to thecontrary, the figures are not necessarily drawn to scale.

FIG. 1 is a cross-sectional view of a portion of a p-type wafersubstrate 102 having a partially fabricated integrated circuit thereon,the integrated circuit including an n-well 104 in the p-substrate 102;shallow trench isolation (STI) structures 106 separating n-well 104 fromat least a portion of p-substrate 102, and further isolating a region ofp-substrate 102 in which a vertically stacked, planar junction Zenerdiode structure is to be formed; and gate structures 108 with sidewallspacers 110, the gate structures 108 being suitable for removal andreplacement with a high-k dielectric material and a metal gate. In thisillustrative embodiment, gate structures 108 are formed frompolycrystalline silicon, and STI structures are filled with dielectricmaterial.

It is noted that the present invention is not limited to verticallystacked, planar junction Zener diode structures that are completelysurrounded by STI structures.

FIG. 2 shows the structure of FIG. 1 after a first hardmask layer 202has been deposited, and then patterned to expose areas 204, 205 in whichrecesses are to be formed for subsequent p+ epi growth. First hardmask202 is typically formed from silicon nitride, but the present inventionis not limited to any particular masking material.

FIG. 3 shows the structure of FIG. 2 after recesses 302, 303 are formedfor PFET source/drains (S/D) and a Zener diode anode respectively.Recesses 302 are formed in n-well 104 and recess 303 is formed inp-substrate 102. It is noted that because the doping types andconcentrations in the n-well 104 and the p-substrate 102 are differentfrom each other, their removal rates when simultaneously exposed to thesame etch chemistry will be different. However, this difference isgenerally too small to require separate etching steps for the n-well andp-substrate. Those skilled in the field will readily determine, withoutundue experimentation, whether any particular implementation of thepresent invention requires the separate etch steps and the costsassociated with the additional processing.

FIG. 4 shows the structure of FIG. 3 after p+ epi growth forms the PFETS/D's 402 and the Zener diode anode 403; and after the first hardmaskhas been removed. Epitaxial growth processes are well-known in the fieldof semiconductor manufacturing and are not described in greater detailhere. in typical embodiments, the first hardmask is formed from siliconnitride, and may be removed with conventional silicon nitride etchprocessing. In an alternative embodiment the first hardmask remains onthe surface and a second hardmask layer is deposited over the wafer andthen patterned to expose openings for the formation of NFET raised S/Dterminals and cathode side of the diode by n+ epi growth.

FIG. 5 shows the structure of FIG. 4 after a second hardmask layer 502has been deposited and patterned to expose areas 504, 505 in which n+epi growth is to take place to form NFET S/D's and a Zener diode cathoderespectively. The second hardmask 502 is typically formed from siliconnitride. It is noted opening 505 does not expose the entire surfaceregion of anode 403. In this way, a portion of the p+ is available forthe formation of a contact.

In an alternative process flow, the entire surface of anode 403 could beexposed by an opening in hardmask 502, and the covered by an n+ epilayer. However, this has the disadvantage that a further masking andetching operation would be needed to expose a region of anode 403 onwhich to make electrical contact.

FIG. 6 shows the structure of FIG. 5 after n+ epi growth forms NFETraised S/D terminals 602 and a Zener diode cathode 603. In this way,cathode 603 is formed simultaneously with the same epitaxial growthprocess that forms the NFET raised S/D's 602.

FIG. 7 shows the structure of FIG. 6 after the second hardmask 502 hasbeen removed, and contact structures 702, 704 have been formed to makeelectrical contact with both the anode (i.e., p+) 403 and the cathode(i.e., n+) 603 of the Zener diode. In some embodiments contacts 702, 704are formed from copper (Cu). It is well-known in the field ofsemiconductor manufacturing that prior to Cu plating, a barrier layer isformed in the trenches in which the Cu structures are plated up. In someembodiments of the present invention, before the contact structures areformed, the exposed surfaces of anode 403 and cathode 603 are silicided.In some embodiments, a Ni silicide layer is formed on the exposedsurfaces of anode 403 and cathode 603 prior to the formation of contactstructures 702, 704.

It is noted that the height of contact structure 702 is less than thatof contact structure 704 and further noted that the top surfaces ofcontact structures 702, 704 are substantially coplanar. Contactstructure 704 has a greater height because it is based on a relativelylower layer, anode 403, whereas contact structure 702 is based on therelatively higher layer, cathode 603. In typical embodiments, the topsurfaces of contact structures 702, 704 are formed by the samechemical-mechanical polishing (CMP) operation, and therefore aresubstantially coplanar. In this context, substantially coplanar meansthat within the manufacturing tolerances of the CMP operation, the topsurfaces of contact structures 702, 704 are in the same plane. Thepresent invention is not limited to any particular CMP pads, padconditioning, slurry composition, flow rates, temperatures, contactpressures, rotation speeds, and so on.

Subsequent to the formation of the raised S/D terminals and diode,conventional process steps may be performed to complete the transistors(e.g., gate replacement) and interconnection (e.g., multiple layers ofinterconnect lines).

Structure

FIG. 7, discussed above in connection with an illustrative process flow,shows the structure of a vertically stacked, planar junction diodestructure. In the illustrative structure of FIG. 7, a region of p-typesubstrate 102 is defined by an enclosing it with STI structure 106. Arecess formed in the surface of the defined region has a p+ epitaxiallayer 403 formed therein. The depth of the recess, and thickness anddoping concentration of p+ epitaxial layer 403 are substantially thesame as those of the PFET S/D terminals 402. It is noted that slightvariations in the recess depths for the PFET S/D terminals and the diodeanode layer may be different because they are formed in regions of thesubstrate having different dopant types and this may cause somedifference in etch rates with respect to a given etch chemistry. Thesesmall differences do not adversely affect the electrical characteristicsof the diode. An n+ epitaxial layer 603 is formed on top of the p+epitaxial layer 403.

Still referring to FIG. 7, each of the diode junction layers 403, 603 isprovided with a contact structure 704, 702. The present invention is notlimited to any particular relative positioning of contact structures702, 704. In other words, the contact structures may be placed anywherewithin the diode region, the contact structures may have any shape, andthere may be more than one contact structure disposed on either of thediode junction layers.

Thus, vertically stacked, planar junction diode structures that arecompatible with the formation of epitaxially formed, raised source/drainterminals in gate-last, high-k MOSFET integrated circuits have beendescribed.

In one illustrative embodiment of the present invention an integratedcircuit, includes a substrate of a first conductivity type; a well of asecond conductivity type disposed in the substrate; a first gateelectrode structure disposed over the well; a second gate electrodestructure disposed over the substrate outside the area of the well; afirst set of S/D terminals disposed in corresponding recesses in thewell, the first set of S/D terminals adjacent to the first gateelectrode structure; a first planar diode junction of the firstconductivity type disposed in a recess in the substrate, the recessformed in a region of the substrate outside of the well; a second set ofS/D terminals disposed on the surface of the substrate, the second setof S/D terminals adjacent to the second gate electrode structure; and asecond planar diode junction of the second conductivity type disposedover at least a portion of the first planar diode junction. Typicalembodiments further include a first contact structure in electricalcontact with the first planar diode junction; and a second contactstructure in electrical contact with the second planar diode junction.In this illustrative embodiment, the first conductivity type is p-typeand the second conductivity type is n-type. In various embodiments ofthe present invention, the well is at least partially isolated from thesubstrate by a first STI structure, and the first planar diode junctionis at least partially isolated from the substrate by a second STIstructure. In the illustrative embodiment, both the first planar diodejunction and the second planar diode junction are epitaxial layers.

In an illustrative method in accordance with the present invention, andshown in FIG. 8, forming an integrated circuit including PFETs, NFETs,and at least one vertically stacked, planar junction Zener diode,includes providing 802 a substrate of a first conductivity type; forming804 a first gate electrode structure over a well of a secondconductivity type, the well disposed in the substrate; forming 806 asecond gate electrode structure over the substrate in an area outsidethe well; forming 808 recesses in the well adjacent to the first gateelectrode structure, and simultaneously forming at least one recess inthe substrate in an area outside the well; epitaxially growing 810 firstsource/drain (S/D) terminals in the recesses adjacent to the first gateelectrode structure, and simultaneously epitaxially growing 812 a firstplanar diode junction in the recess outside the well; and epitaxiallygrowing second S/D terminals adjacent to the second gate electrodestructure, and simultaneously epitaxially growing a second planar diodejunction over at least a portion of the first planar diode junction;wherein the second S/D terminals are raised S/D terminals. Such a methodtypically further includes forming a plurality of shallow trenchisolation (STI) structures in the substrate; wherein both the well andthe first planar diode junction are at least partially isolated from thesubstrate by STI structures. Subsequent to formation of a verticallystacked, planar junction diode, such illustrative processes furtherinclude removing the polysilicon gate electrodes and forming metal gateelectrodes over a high-k gate dielectric layer.

Various embodiments of the present invention may be implemented withtwin-well processes, such that a vertically stacked, planar junctionZener diode structure is disposed in a well rather than in the bulksubstrate.

CONCLUSION

It is to be appreciated that the Detailed Description section, and notthe Abstract of the Disclosure, is intended to be used to interpret theclaims. The Abstract of the Disclosure may set forth one or more, butnot all, exemplary embodiments of the invention, and thus, is notintended to limit the invention and the subjoined Claims in any way.

It will be apparent to those skilled in the relevant art(s) that variouschanges in form and detail can be made therein without departing fromthe spirit and scope of the invention. Thus the invention should not belimited by any of the above-described exemplary embodiments, but shouldbe defined only in accordance with the subjoined Claims and theirequivalents.

What is claimed is:
 1. A method of forming an integrated circuitincluding PFETs, NFETs, and at least one vertically stacked, planarjunction Zener diode, comprising: providing a substrate of a firstconductivity type; forming a first gate electrode structure over a wellof a second conductivity type, the well disposed in the substrate;forming a second gate electrode structure over the substrate in an areaoutside the well; forming recesses in the well adjacent to the firstgate electrode structure, and simultaneously forming at least one recessin the substrate in an area outside the well; epitaxially growing firstsource/drain (S/D) terminals in the recesses adjacent to the first gateelectrode structure, and simultaneously epitaxially growing a firstplanar diode junction in the recess outside the well; and epitaxiallygrowing second S/D terminals adjacent to the second gate electrodestructure, and simultaneously epitaxially growing a second planar diodejunction over at least a portion of the first planar diode junction;wherein the second S/D terminals are raised S/D terminals.
 2. The methodof claim 1, further comprising: forming a plurality of shallow trenchisolation (STI) structures in the substrate; wherein both the well andthe first planar diode junction are at least partially isolated from thesubstrate by STI structures.
 3. The method of claim 2, wherein the STIstructures are filled with a dielectric material.
 4. The method of claim1, wherein the gate electrode structures include sidewall spacers. 5.The method of claim 1, wherein the gate electrode structures includepolysilicon with sidewall spacers disposed adjacent to the polysilicon.6. The method of claim 1, further comprising: depositing a firsthardmask layer and patterning the first hardmask layer to form openingsadjacent to the first gate electrode structure, and in the area outsidethe well in which the first planar diode junction is to be formed;wherein the openings are formed prior to forming recesses in the welladjacent to the first gate electrode structure, and simultaneouslyforming at least one recess in the substrate in an area outside thewell.
 7. The method of claim 6, wherein depositing the first hardmasklayer comprises depositing a layer comprising silicon nitride.
 8. Themethod of claim 6, further comprising: removing the patterned firsthardmask layer; and depositing a second hardmask layer and patterningthe second hardmask layer to form openings therein; wherein the openingsin the second hardmask layer expose S/D regions adjacent to the secondgate electrode structure, and at least a portion of the first planardiode junction.
 9. The method of claim 1, wherein the first conductivitytype is p-type and the second conductivity type is n-type.
 10. Themethod of claim 8, further comprising removing the polysilicon gateelectrodes and forming metal gate electrodes over a high-k gatedielectric layer.
 11. A method of forming a Zener diode in a processcompatible with the production of gate-last, high-k, PFETs and NFETs,comprising: depositing a first silicon nitride hardmask layer over awafer having partially fabricated integrated circuits thereon;patterning the first silicon nitride hardmask layer to form openingsthat define PFET S/D recesses and at least one Zener diode anode region;forming recesses for PFET S/D terminals and at least one Zener diodeanode; and simultaneously epitaxially growing PFET S/D terminals and atleast one Zener diode anode.
 12. The method of claim 11, furthercomprising: removing the first silicon nitride hardmask; depositing asecond silicon nitride hardmask layer and patterning the second siliconnitride hardmask layer to form openings that define NFET S/D terminalsand at least one Zener diode cathode; and simultaneously epitaxiallygrowing the NFET terminals and the at least one Zener diode cathode. 13.The method of claim 12, wherein the NFET S/D terminals are raised S/Dterminals.
 14. The method of claim 13, wherein the Zener diode anode hasa first area and the Zener diode cathode has a second area, and thesecond area is larger than the first area.
 15. The method of claim 14,wherein the second silicon nitride hardmask is removed and a firstcontact structure is disposed on the Zener diode cathode and a secondcontact structure is disposed on the Zener diode anode.
 16. A method formanufacturing an integrated circuit having a PFET, an NFET, and avertically stacked, planar junction Zener diode, comprising: providing asubstrate having a first region of a first conductivity type and asecond region of a second conductivity type; forming a first shallowtrench isolation structure in the second region to at least partiallyisolate the first region from the second region; forming a secondshallow trench isolation structure in the second region to at leastpartially isolate a Zener diode portion of the second region from aremainder of the second region; forming a first gate electrode structurehaving sidewall spacers over the first region, and a second gateelectrode structure having sidewall spacers over the second region;etching, concurrently, a first S/D recess adjacent to a first side ofthe first gate electrode structure, a second S/D recess adjacent to asecond side of the first gate electrode structure, and a Zener dioderecess in the Zener diode portion of the second region; growing,concurrently, a first S/D terminal, at least a portion of which isdisposed in the first S/D recess, a second S/D terminal, at least aportion of which is disposed in the second S/D recess, and a firstterminal of a Zener diode, at least a portion of which is disposed inthe Zener diode recess; disposing a masking layer over the substrate;patterning the masking layer so that openings are formed therethrough,the openings exposing a regions adjacent to a first side of the secondgate electrode structure, and adjacent to a second side of the secondgate electrode structure, and further exposing a portion of the firstterminal of the Zener diode; growing, concurrently, a third S/D terminaladjacent the first side of the second gate electrode structure, a fourthS/D terminal adjacent the second side of the second gate electrodestructure, and a second terminal of the Zener diode superjacent thefirst terminal of the Zener diode; and replacing the first and secondgate electrode structures with third and fourth gate electrodestructures; wherein the first S/D terminal, the second S/D terminal andthe first Zener diode terminal each comprise a semiconductor material ofthe second conductivity type, and the third S/D terminal, the fourth S/Dterminal and the second Zener diode terminal each comprise asemiconductor material of the first conductivity type.
 17. The method ofclaim 16, wherein forming the first shallow trench isolation structurecomprises forming the first shallow trench isolation structure adjacentto the first region.
 18. The method of claim 16, wherein growing thefirst S/D terminal, the second S/D terminal, and the first terminal ofthe Zener diode comprises epitaxially growing.
 19. The method of claim16, wherein growing the third S/D terminal, the fourth S/D terminal, andthe second terminal of the Zener diode comprises epitaxially growing.20. The method of claim 16, further comprising: forming a first contactstructure in electrical contact with the first Zener diode terminal; andforming a second contact structure in electrical contact with the secondZener diode terminal.